Shenzhen Hengstar Technology Co., Ltd.

Shenzhen Hengstar Technology Co., Ltd.

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Shenzhen Hengstar Technology Co., Ltd.
HomeZamakonoZowonjezera za mafakitaleDDR3 Udimm Memory Prople

DDR3 Udimm Memory Prople

Mtundu wa Malipiro:
L/C,T/T,D/A
Incoterm:
FOB,EXW,CIF
Mphindi. Dongosolo:
1 Piece/Pieces
Maulendo:
Ocean,Air,Express,Land
  • Mafotokozedwe Akatundu
Overview
Zizindikiro Zogulitsa

Chitsanzo ChaNSO4GU3AB

Wonjezerani Luso & Informations Zowonjez...

MaulendoOcean,Air,Express,Land

Mtundu wa MalipiroL/C,T/T,D/A

IncotermFOB,EXW,CIF

Kuyika & Kutumiza
Kugulitsa Units:
Piece/Pieces

4Gb 1600mhz 240-Pin ddr3 udimm


Kukonzanso mbiri

Revision No.

History

Draft Date

Remark

1.0

Initial Release

Apr. 2022

 

Kuyitanitsa pagome lazidziwitso

Model

Density

Speed

Organization

Component Composition

NS04GU3AB

4GB

1600MHz

512Mx64bit

DDR3 256Mx8 *16


Kaonekeswe
Hengstar osavomerezeka DDR3 SMMM ism (yopanda kanthu kena ka kawirikawiri) ma module okumbutsa) Ns04bu3ab ndi 512m x 64-bit awiri a 4GB cl11v cl11v sdram mankhwala osokoneza bongo, kutengera zigawo zisanu ndi chimodzi 256m. The Spd imapangidwa ku Jedec Mofananamo Ddr3-1600 nthawi ya 11-11-11 ku 1.5V. Chingwe chilichonse cha 240-pini chimagwiritsa ntchito zala zolumikizira golide. The SDRAM yomwe idasankhidwa imagwiritsidwa ntchito kuti igwiritsidwe ntchito ngati kukumbukira kwakukulu mukayika m'magulu monga ma PC ndi ma PC ndi ma PC ndi GrandStations.


Mawonekedwe
Kutumiza: VDD = 1.5V (1.425V mpaka 1.575V)
vdnq = 1.5V (1.425V mpaka 1.575V)
800mhz fck ya 1600MB / pini
8 bank yamkati yamkati
11, 10, 9, 8, 7, 6
progragram yowonjezera yowonjezera: 0, cl - 2, kapena cl - 1 koloko
8-bit pre-feta
Kutalika kwa burst: 8 (osakhazikika popanda malire, zotsatizana ndi adilesi yoyambira "000 zokha), 4 ndi TcCD =
bi-njira yosinthira
Mayina (kudziletsa); Kudzikuza kwamkati kudzera pa zq pini (Rzq: 240 Ohm ± 1%)
on Die Dimestion pogwiritsa ntchito pini
verage omasuka nthawi yayitali 7.8us otsika kuposa Thumba la Thumba la 85 ° C, 3.9US pa 85 ° C <95 ° <95 ° C
Bwezeretsaninso
Makina obwereketsa osinthika amayendetsa mphamvu
ly-mwapamwamba
pcb: Kutalika 1.18 "(30mm)
rohss zogwirizana ndi zopanda pake


Njira zazikulu za nthawi

MT/s

tRCD(ns)

tRP(ns)

tRC(ns)

CL-tRCD-tRP

DDR3-1600

13.125

13.125

48.125

2011/11/11


Tebulo la adilesi

Configuration

Refresh count

Row address

Device bank address

Device configuration

Column Address

Module rank address

4GB

8K

32K A[14:0]

8 BA[2:0]

2Gb (256 Meg x 8)

1K A[9:0]

2 S#[1:0]


Kufotokozera

Symbol

Type

Description

Ax

Input

Address inputs: Provide the row address  for ACTIVE commands, and the column
address and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments table for density-specific
addressing information.

BAx

Input

Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.

CKx,
CKx#

Input

Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.

CKEx

Input

Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circuitry
and clocks on the DRAM.

DMx

Input

Data mask (x8 devices only): DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH, along with that input data, during a write access.
Although DM pins are input-only, DM loading is designed to match that of the DQ and DQS pins.

ODTx

Input

On-die  termination:  Enables  (registered  HIGH)  and  disables  (registered  LOW)
termination resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input will be ignored if disabled via the LOAD MODE command.

Par_In

Input

Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.

RAS#,
CAS#,
WE#

Input

Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.

RESET#

Input
(LVCMOS)

Reset: RESET# is an active LOW asychronous input that is connected to each DRAM and
the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitialized as
though a normal power-up was executed.

Sx#

Input

Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.

SAx

Input

Serial address inputs: Used to configure the temperature sensor/SPD EEPROM address
range on the I2C bus.

SCL

Input

Serial
communication to and from the temperature sensor/SPD EEPROM on the I2C bus.

CBx

I/O

Check bits: Used for system error detection and correction.

DQx

I/O

Data input/output: Bidirectional data bus.

DQSx,
DQSx#

I/O

Data strobe: Differential data strobes. Output with read data; edge-aligned with read data;
input with write data; center-alig

SDA

I/O

Serial
sensor/SPD EEPROM on the I2C bus.

TDQSx,
TDQSx#

Output

Redundant data strobe (x8 devices only): TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are no
function.

Err_Out#

Output (open
drain)

Parity error output: Parity error found on the command and address bus.

EVENT#

Output (open
drain)

Temperature event: The EVENT# pin is asserted by the temperature sensor when critical
temperature thresholds have been exceeded.

VDD

Supply

Power supply: 1.35V (1.283–1.45V) backward-compatible to 1.5V (1.425–1.575V). The
component VDD and VDDQ are connected to the module VDD.

VDDSPD

Supply

Temperature sensor/SPD EEPROM power supply: 3.0–3.6V.

VREFCA

Supply

Reference voltage: Control, command, and address VDD/2.

VREFDQ

Supply

Reference voltage: DQ, DM VDD/2.

VSS

Supply

Ground.

VTT

Supply

Termination voltage: Used for control, command, and address VDD/2.

NC

No connect: These pins are not connected on the module.

NF

No function: These pins are connected within the module, but provide no functionality.

Zolemba : Gome yomwe ili pansipa ndi mndandanda wambiri wa zikhomo zonse zomwe zingatheke kwa ma module onse a DDR3. Zikhomo zonse zomwe zalembedwa osathandizidwa pa gawo ili. Onani zipika za pini pazidziwitso za gawo ili.


Chithunzi chojambulidwa

4GB, 512Mx64 Module (2Nank of X8)

1


2


Zindikirani:
1.the mpira wa zq pagawo lililonse la DDR3 amalumikizidwa ndi 240ω ± 1% womangiriridwa. Amagwiritsidwa ntchito ngati kayendetsedwe kazinthu zomwe zimapangitsa kuti zitheke komanso zolaula.



Magawo a module


Kuyang'ana Kwapakati

3

Kuyang'ana Kwapakati

4

Zolemba:
Mitundu ya 1.all ili mu mamilimita (mainchesi); Max / min kapena wamba (njira) pomwe zidadziwika.
2.Tancerance pazaing'ono zonse ± 0.15mm pokhapokha atatchulidwa.
3. Kujambula pang'ono ndikungotanthauza.

Zida Zamagulu : Zowonjezera za mafakitale

Imelo kwa wogulitsa uyu
  • *Mutu:
  • *Kuti:
    Mr. Jummary
  • *Imelo:
  • *Uthenga:
    Uthenga wanu uyenera kukhala pakati pa makina 20-8000
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